这就需要用到Bonding模板。

   Bonding模板就是在模板所对应的PCB bonding位处加

做一个小盖，以避开COB器件达到平整印刷的目的。

   Bonding模板必须使用橡胶刮刀（或特殊的钢片刮刀）。

此模板一般要求COB高度≤3mm。

It is still necessary to have solder paste printed even after the COB components are

placed and fixed. In these situations, bonding stencils should be used.

Bonding stencils add caps on the respective PCB bonding locations to

prevent printing over the components.

Notes: Rubber squeegees (or special steel scrapers) must be used. Normally,

the height of the COB component installed should not exceed 3mm.