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  镀镍模板(Ni.P.Stencil)
 
  为了减少锡膏与孔壁之间的摩擦力,便于脱模,进一步改善锡膏的释放效果,

在2004年初,伟创新公司在传统减成工艺“电抛光”模板基础上,增加了特别的后

处理加成工艺——“镀镍”,并获得专利。镀镍模板结合了激光模板与电铸模板的

优点,让EMS(电子制造服务)企业有了更广泛的选择!

  Ni. P. Stencil

To alleviate the friction force between hole walls and solder paste

and improve the volatile effects, in the year of 2004, Sunshine

adopted the special post manufacturing and forming method. This is known as Nickel

plating, a method based upon the traditional glitches electric

polishing method. This patent has been registered. (Please refer

to the Standard IPC7525, patent register number ZL03 2 20908.8)

The nickel plating stencil combines all the advantages of laser stencils

and electric casting stencils to provide additional options for electric

manufacturing services.