超密间距（如μBGA、CSP）被广泛应用，这样一来，SMT行业对印刷

模板也提出了更高的要求，电铸模板应运而生。

我公司制作的电铸模板特点是：

在同一张模板上可做成不同厚度，特别适用于超细体积（如0201）、

超密间距（如μBGA、CSP）元件印刷。

To meet the requirements and trends associated with electronic products (e.g. short, small, light and thin), ultra-fine

volume and ultra-fine pitch components are utilized. Thus there are higher expectations in the production of

printing stencils and electro-formed stencils. Features of our electro-formed stencils:

*Different thickness can be applied on the same stencils.

*Suitable for the printing fine pitch components. (e.g.μBGA, CSP and 0201)